Inventor
Enchao Yu
Inventor
Irvine, CA, US
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1067%
H05KPrinted circuits33%
PatentTitleYear
8,864,500'Electronic module with flexible portion'20148,705,239'Heat dissipation for electronic modules'20148,488,325'Memory module having thermal conduits'20138,287,291'Circuit with flexible portion'20128,033,836'Circuit with flexible portion'20118,018,723'Heat dissipation for electronic modules'20117,839,643'Heat spreader for memory modules'20107,811,097'Circuit with flexible portion'20107,619,893'Heat spreader for electronic modules'20097,442,050'Circuit card with flexible connection for memory module with heat spreader'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2014Patents assigned to NETLIST INC (10)· patent assignee history
2008–2014Based in Irvine, CA, US· patent location history
2012–2014Patents assigned to YU ENCHAO (3)· patent assignee history
2012Patents assigned to BHAKTA JAYESH R (1)· patent assignee history
2012Patents assigned to CHEN CHI SHE (1)· patent assignee history
2014Patents assigned to AN ZHIYONG (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NETLIST INC | 10 | 2008–2014 |
| YU ENCHAOself | 3 | 2012–2014 |
| AN ZHIYONG | 1 | 2014 |
| BHAKTA JAYESH R | 1 | 2012 |
| CHEN CHI SHE | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Irvine, California, US | 10 | 2008–2014 |