Inventor
JAGAT SHAKYA
Inventor
US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Rprimary
G01RMeasuring electric variables25%
H01LSemiconductor devices25%
B81BMicrostructural devices or systems, e.g. micromechanical devices17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
PatentTitleYear
12,163,982Microbump cluster probing architecture for 2.5D and 3D dies202411,749,628Sacrificial redistribution layer in microelectronic assemblies having direct bonding202311,740,282Apparatuses and methods for monitoring health of probing u-bump cluster using current divider202311,527,501Sacrificial redistribution layer in microelectronic assemblies having direct bonding202211,486,923Apparatuses and methods for mitigating sticking of units-under-test2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to INTEL CORP (5)· patent assignee history
2022–2024Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 5 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 5 | 2022–2024 |