Inventor
Shigemasa Satoh
Inventor
Hadano, JP
Overview
Patents· 2 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact17%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application17%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices17%
H05KPrinted circuits17%
Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2013Patents assigned to HITACHI LTD (2)· patent assignee history
1999–2013Based in Hadano, JP· patent location history
2013Patents assigned to IDEI AKIO (1)· patent assignee history
2013Patents assigned to KONDO YOSHIHIRO (1)· patent assignee history
2013Patents assigned to NAKAJIMA TADAKATSU (1)· patent assignee history
2013Patents assigned to SASAKI SHIGEYUKI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 2 | 1999–2013 |
| IDEI AKIO | 1 | 2013 |
| KONDO YOSHIHIRO | 1 | 2013 |
| NAKAJIMA TADAKATSU | 1 | 2013 |
| SASAKI SHIGEYUKI | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hadano, JP | 2 | 1999–2013 |