Inventor
DAVID W. MENDEL
Inventor
US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing28%
H03KPulse technique16%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
H01LSemiconductor devices12%
H04WWireless communication networks12%
H10BElectronic memory devices12%
H03MCoding4%
PatentTitleYear
12,191,893Seemingly monolithic interface between separate integrated circuit die202512,135,667Interface bridge between integrated circuit die202412,086,088Multichip package with protocol-configurable data paths202411,693,810Interface bridge between integrated circuit die202311,669,479Multichip package with protocol-configurable data paths202311,294,842Multichip package with protocol-configurable data paths202211,237,998Interface bridge between integrated circuit die2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to ALTERA CORP (5)· patent assignee history
2022–2025Patents assigned to INTEL CORP (4)· patent assignee history
2022–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ALTERA CORP | 5 | 2022–2025 |
| INTEL CORP | 4 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 7 | 2022–2025 |