Inventor
Cheng-Ta Kuo
Inventor
Hsinchu, TW
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Hprimary
H10HInorganic light-emitting semiconductor devices having potential barriers48%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
H01LSemiconductor devices16%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
F21VFunctional features or details of lighting devices or systems thereof2%
F21YIndexing scheme associated with subclasses f21k, f21l, f21s and f21v, relating to the form or the kind of the light sources or of the colour of the light emitted2%
H10DInorganic electric semiconductor devices2%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation2%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution2%
PatentTitleYear
10,811,578LED carrier and LED package having the same20209,461,213'LED sub-mount and method for manufacturing light emitting device using the sub-mount'20169,447,959'Heat sink for electrical elements and light-emitting device containing thereof'20169,276,173'Light-emitting device'20169,231,158'Light-emitting diode structure with electrode pads of similar surface roughness and method for manufacturing the same'20169,153,736'Light-emitting diode device and method for fabricating the same'20158,823,039'Light-emitting device'20148,729,525'Opto-electronic device'20148,487,317'GaN semiconductor device'20138,445,327'Light-emitting diode package and wafer-level packaging process of light-emitting diode'20138,415,683'Light emitting diode chip'20138,278,681'Light-emitting diode package and wafer-level packaging process of light-emitting diode'20128,188,505'Light-emitting device'20128,076,686'Light emitting diode and manufacturing method thereof'20118,012,777'Packaging process of light emitting diode'20118,008,680'Light-emitting diode device and manufacturing method thereof'20117,935,981'Light emitting diode package'20117,902,562'Light emitting diode device that includes a three dimensional cloud structure and manufacturing method thereof'20117,888,162'Method of manufacturing a photoelectronic device'20117,821,026'Light emitting diode device and manufacturing method therof'20107,153,713'Method for manufacturing high efficiency light-emitting diodes'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006Based in Tainan, TW· patent location history
2010–2016Patents assigned to EPISTAR CORP (11)· patent assignee history
2010–2020Based in Hsinchu, TW· patent location history
2011–2016Patents assigned to KUO CHENG-TA (9)· patent assignee history
2011–2020Patents assigned to LEXTAR ELECTRONICS CORP (9)· patent assignee history
2011–2014Patents assigned to CHEN WEI-SHOU (3)· patent assignee history
2012–2013Patents assigned to HSIA DER-LING (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| EPISTAR CORP | 11 | 2010–2016 |
| KUO CHENG-TAself | 9 | 2011–2016 |
| LEXTAR ELECTRONICS CORP | 9 | 2011–2020 |
| CHEN WEI-SHOU | 3 | 2011–2014 |
| HSIA DER-LING | 3 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 20 | 2010–2020 |
| Tainan, TW | 1 | 2006 |