Inventor
Kanji Ishibashi
Inventor
Kyoto, JP
Overview
Patents· 1 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B26Dprimary
B26DCutting20%
B28DWorking stone or stone-like materials20%
H01LSemiconductor devices20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
PatentTitleYear
9,595,483'Cutting device and cutting method'2017Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017Patents assigned to TOWA CORP (1)· patent assignee history
2017Based in Kyoto, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOWA CORP | 1 | 2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kyoto, JP | 1 | 2017 |