Inventor

Jia Liu

Inventor
San Jose, CA, US

Overview

43→
Patents
2003–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 43 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G02Bprimary
G02BOptical elements, systems or apparatus17%
H05KPrinted circuits12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
H04LTransmission of digital information, e.g. telegraphic communication9%
H04WWireless communication networks7%
A61KPreparations for medical, dental or toiletry purposes5%
A61PSpecific therapeutic activity of chemical compounds or medicinal preparations5%
G06FElectric digital data processing4%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use4%
C07DHeterocyclic compounds3%
PatentTitleYear
11,103,025Headband and multifunctional helmet202110,940,465Acid-resistant alloy catalyst202110,533,011Pharmaceutical salts, physical forms, and compositions of pyrrolopyrimidine kinase inhibitors, and methods of making same202010,508,279Recombinant 201910,497,273Method and system for recording and playback of web-based instructions201910,313,302Methods for NAT (network address translation) traversal and systems using the same201910,282,576Book placing attitude recognition method based on RSSI signal value of RFID201910,275,620Book sorting method on the basis of RSSI signal value of RFID tag201910,235,186Method and associated apparatus for performing wake-up management on network devices201910,003,630Method, apparatus and computer program product for managing static uniform resource locator access20189,973,876Application recommendations20189,743,218'Proxy connection method and apparatus'20179,686,811'Method and apparatus for wireless peer-to-peer communication with multiple radio interfaces'20179,661,443'Method, apparatus, and computer program product for data distribution in wireless networks'20179,647,966'Device, method and non-transitory computer readable storage medium for performing instant message communication'20179,623,111'Pegylated artesunate derivative, pharmaceutical composition and use thereof'20179,544,713'Using bluetooth low energy'20179,415,011'Method for treatment of liver cancer and inhibition of metastasis with CXC-chemokine-receptor 4-targeted nanoparticle'20169,354,995'Method for controlling operations of server cluster'20169,344,204'Method, apparatus, and computer program product for adaptive relaying data distribution in wireless networks'20169,232,384'Method, apparatus, and computer program product for adaptive device discovery in wireless networks'20167,928,226'Salts and polymorphs of a VEGF-R inhibitor'20117,492,684'Method and apparatus for controlling a tilt between an optical axis of an optical pick-up head and an optical disc'20097,431,516'Optical sub-assembly packaging techniques that incorporate optical lenses'20087,432,575'Two-layer electrical substrate for optical devices'20087,269,027'Ceramic optical sub-assembly for optoelectronic modules'20077,268,126'Polymorphic and amorphous forms of the phosphate salt of 8-fluoro-2-{4-[(methylamino)methyl]phenyl}-1,3,4,5-tetrahydro-6H-azepino[5,4,3-ce]indol-6-one'20077,247,942'Techniques for joining an opto-electronic module to a semiconductor package'20077,199,440'Techniques for joining an opto-electronic module to a semiconductor package'20077,086,786'Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology'20067,086,788'Optical sub-assembly for opto-electronic modules'20067,073,961'Optical sub-assembly packaging techniques that incorporate optical lenses'20067,023,705'Ceramic optical sub-assembly for optoelectronic modules'20066,916,121'Optical sub-assembly for optoelectronic modules'20056,863,450'Optical sub-assembly packaging techniques that incorporate optical lenses'20056,858,468'Techniques for joining an opto-electronic module to a semiconductor package'20056,838,317'Techniques for joining an opto-electronic module to a semiconductor package'20056,802,654'Electrical connector for opto-electronic modules'20046,767,140'Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology'20046,765,275'Two-layer electrical substrate for optical devices'20046,749,345'Apparatus and method for electro-optical packages that facilitate the coupling of optical cables to printed circuit boards'20046,642,613'Techniques for joining an opto-electronic module to a semiconductor package'20036,628,000'Techniques for maintaining parallelism between optical and chip sub-assemblies'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003–2008Patents assigned to NAT SEMICONDUCTOR CORP (19)· patent assignee history
2003–2008Based in San Jose, CA, US· patent location history
2007–2020Based in San Diego, CA, US· patent location history
2016–2018Patents assigned to NOKIA TECHNOLOGIES OY (7)· patent assignee history
2016–2019Patents assigned to LIU JIA (6)· patent assignee history
2016–2017Patents assigned to CHEN CANFENG (5)· patent assignee history
2016–2019Patents assigned to SYNOLOGY INC (5)· patent assignee history
2016–2018Based in Beijing, CN· patent location history
2016–2019Based in New Taipei, TW· patent location history
2019Based in Nanjing, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NAT SEMICONDUCTOR CORP192003–2008
NOKIA TECHNOLOGIES OY72016–2018
LIU JIAself62016–2019
CHEN CANFENG52016–2017
SYNOLOGY INC52016–2019
Locations
LocationPatentsSpan
San Jose, California, US192003–2008
Beijing, CN82016–2018
New Taipei, TW52016–2019
San Diego, California, US32007–2020
Nanjing, CN22019