Inventor

Jwo-Huei Jou

Inventor

Hsinchu, TW

Overview

1995–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 40 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Kprimary

H10KOrganic electric solid-state devices30%

H01LSemiconductor devices11%

H05BElectric heating7%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%

C07DHeterocyclic compounds5%

C09KMaterials for miscellaneous applications, not provided for elsewhere5%

G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light3%

Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution3%

C07CAcyclic or carbocyclic compounds2%

C07FAcyclic, carbocyclic or heterocyclic compounds containing elements other than carbon, hydrogen, halogen, oxygen, nitrogen, sulfur, selenium or tellurium2%

PatentTitleYear

10,663,144Human body-friendly light source2020 10,598,547Device for measuring melatonin suppression induced by light source2020 10,522,792Luminance and color temperature tunable tandem OLED2019 10,439,004High-efficiency OLED device2019 9,887,357'Method for manufacturing an organic element'2018 9,803,811'Method for producing high-quality light'2017 9,755,154'Spirally configured cis-stilbene/fluorene hybrid materials for organic light-emitting diode'2017 9,419,227'Spirally configured cis-stilbene/fluorene hybrid materials as hole-blocking type electron-transporters for OLED'2016 9,346,756'Electro-fluorescent emitter for ultra-violet OLED'2016 9,287,508'Light-emitting material'2016 9,266,833'Carrier transport material'2016 9,209,413'Spirally configured cis-stilbene/fluorene hybrid materials as hole-blocking type electron-transporters for OLED'2015 9,013,696'Light quality evaluating device'2015 8,835,215'Method for forming superior local conductivity in self-organized nanodots of transparent conductive film by femtosecond laser'2014 8,809,848'Full-band and high-CRI organic light-emitting diode'2014 8,812,242'Melatonin suppression extent measuring device'2014 8,692,242'Candlelight-like light organic light-emitting device'2014 8,643,287'Lighting device with switchable day/night illumination mode'2014 8,580,604'Method for preparing OLED by imprinting process'2013 8,581,282'Lighting emitting diode device with directivity and coherency and manufacturing method for providing light with directivity and coherency'2013 8,569,793'Organic light-emitting diode with high color rendering'2013 8,564,208'Lighting device with color temperature adjusting functionality'2013 8,564,015'Organic light-emitting diode with high color rendering'2013 8,445,896'Organic light-emitting diode device with high color rendering'2013 8,368,061'Organic light-emitting diode employing mixed host and method for fabricating the same'2013 8,334,531'High-molecule-based organic light-emitting diode and fabrication method thereof'2012 8,237,884'Organic light-emitting diode device with efficiency roll-up property'2012 8,222,806'Organic light-emitting diode device and manufacturing method thereof'2012 8,216,634'High-molecule-based organic light-emitting diode and fabrication method thereof'2012 8,188,490'Organic light emitting diode and manufacturing method thereof'2012 7,901,962'Method for preparing organic light-emitting diode including two light-emitting layers with two solvents'2011 7,453,200'White-light organic light-emitting diode (OLED) and its fabrication method'2008 6,933,522'Organic electroluminescent device and method for producing the same'2005 6,767,818'Method for forming electrically conductive bumps and devices formed'2004 6,762,554'Electroluminescent device with drying film and method for fabricating the same'2004 6,537,854'Method for bonding IC chips having multi-layered bumps with corrugated surfaces and devices formed'2003 6,365,500'Composite bump bonding'2002 6,084,301'Composite bump structures'2000 5,707,902'Composite bump structure and methods of fabrication'1998 5,393,697'Composite bump structure and methods of fabrication'1995

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1995–2004Patents assigned to IND TECH RES INST (6)· patent assignee history

1995–2020Based in Hsinchu, TW· patent location history

2011–2017Patents assigned to NAT UNIV TSING HUA (24)· patent assignee history

2012–2014Patents assigned to JOU JWO-HUEI (15)· patent assignee history

2012–2014Based in Taipei, TW· patent location history

2013Patents assigned to CHEN SUN-ZEN (2)· patent assignee history

2018–2020Patents assigned to UNIV NAT TSING HUA (5)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
NAT UNIV TSING HUA	24	2011–2017
JOU JWO-HUEIself	15	2012–2014
IND TECH RES INST	6	1995–2004
UNIV NAT TSING HUA	5	2018–2020
CHEN SUN-ZEN	2	2013

Locations

Location	Patents	Span
Hsinchu, TW	35	1995–2020
Taipei, TW	5	2012–2014