Inventor

Diane Sahakian

Inventor

Tempe, AZ, US

Overview

5→

Patents

2006–2013

Patent span

Electricity

Primary field (CPC H)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1083%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation17%

PatentTitleYear

8,581,375'Leadframe-based mold array package heat spreader and fabrication method therefor'2013 8,211,753'Leadframe-based mold array package heat spreader and fabrication method therefor'2012 7,863,730'Array-molded package heat spreader and fabrication method therefor'2011 7,399,658'Pre-molded leadframe and method therefor'2008 7,091,469'Packaging for optoelectronic devices'2006

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2006–2011Patents assigned to ST ASSEMBLY TEST SERVICES LTD (2)· patent assignee history

2006–2013Based in Tempe, AZ, US· patent location history

2008–2013Patents assigned to STATS CHIPPAC LTD (3)· patent assignee history

2012–2013Patents assigned to RAMAKRISHNA KAMBHAMPATI (2)· patent assignee history

2012–2013Patents assigned to SAHAKIAN DIANE (2)· patent assignee history

2012–2013Patents assigned to SHIM IL KWON (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
STATS CHIPPAC LTD	3	2008–2013
RAMAKRISHNA KAMBHAMPATI	2	2012–2013
SAHAKIAN DIANEself	2	2012–2013
SHIM IL KWON	2	2012–2013
ST ASSEMBLY TEST SERVICES LTD	2	2006–2011

Locations

Location	Patents	Span
Tempe, AZ, US	5	2006–2013