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Inventor

Chi Ling Shum

Inventor
Hong Kong, CN

Overview

3→
Patents
2016–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
PatentTitleYear
10,304,759Electronic device and method of making same20199,640,463'Built-up lead frame package and method of making thereof'20179,391,007'Built-up lead frame QFN and DFN packages and method of making thereof'2016

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2016Patents assigned to NXP BV (1)· patent assignee history
2016–2017Based in Hong Kong, CN· patent location history
2017–2019Patents assigned to Nexperia BV (2)· patent assignee history
2019Based in Kwai Chung, HK· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
Nexperia BV22017–2019
NXP BV12016
Locations
LocationPatentsSpan
Hong Kong, CN22016–2017
Kwai Chung, HK12019