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Inventor

Li Fong CHONG

Inventor
MY

Overview

3→
Patents
2023–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
12,512,380Semiconductor packages including a package body with grooves formed therein202512,080,625Semiconductor package with releasable isolation layer protection202411,791,238Semiconductor package with releasable isolation layer protection2023

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023–2024Patents assigned to INFINEON TECHNOLOGIES AUSTRIA AG (2)· patent assignee history
2023–2025Based in MY· patent location history
2025Patents assigned to INFINEON TECHNOLOGIES AG (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INFINEON TECHNOLOGIES AUSTRIA AG22023–2024
INFINEON TECHNOLOGIES AG12025
Locations
LocationPatentsSpan
MY32023–2025