Inventor

Sheng-Chau Chen

Inventor

Tainan, TW

Overview

34→

Patents

2015–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 34 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices31%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation15%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%

H10DInorganic electric semiconductor devices7%

H10HInorganic light-emitting semiconductor devices having potential barriers4%

H10NElectric solid-state devices not otherwise provided for4%

H10BElectronic memory devices2%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%

Y10TTechnical subjects covered by former us classification2%

PatentTitleYear

10,857,651Apparatus of chemical mechanical polishing and operating method thereof2020 10,727,097Mechanisms for cleaning substrate surface for hybrid bonding2020 10,727,077Structure and method to expose memory cells with different sizes2020 10,622,401Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same2020 10,541,297Semiconductor structure having integrated inductor therein2020 10,529,913Techniques for MRAM MTJ top electrode connection2020 10,522,5143DIC structure and methods of forming2019 10,522,487Semiconductor structure and manufacturing method thereof2019 10,504,756Wafer processing method and apparatus2019 10,325,956Deep trench isolation shrinkage method for enhanced device performance2019 10,283,550Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same2019 10,269,770Hybrid bond pad structure2019 10,177,106Conductive pad structure for hybrid bonding and methods of forming same2019 10,163,651Structure and method to expose memory cells with different sizes2018 10,164,001Semiconductor structure having integrated inductor therein2018 10,096,515Interconnect structure for stacked device2018 10,074,612Method for forming alignment marks and structure of same2018 10,050,0183DIC structure and methods of forming2018 10,043,705Memory device and method of forming thereof2018 9,960,200Selective deposition and planarization for a CMOS image sensor2018 9,887,182'3DIC structure and method for hybrid bonding semiconductor wafers'2018 9,859,326'Semiconductor devices, image sensors, and methods of manufacture thereof'2018 9,859,323'Complementary metal-oxide-semiconductor (CMOS) image sensor'2018 9,842,816'Conductive pad structure for hybrid bonding and methods of forming same'2017 9,837,291Wafer processing method and apparatus2017 9,786,619'Semiconductor structure and manufacturing method thereof'2017 9,704,827'Hybrid bond pad structure'2017 9,666,566'3DIC structure and method for hybrid bonding semiconductor wafers'2017 9,653,507'Deep trench isolation shrinkage method for enhanced device performance'2017 9,627,326'Method for forming alignment marks and structure of same'2017 9,437,572'Conductive pad structure for hybrid bonding and methods of forming same'2016 9,355,964'Method for forming alignment marks and structure of same'2016 9,281,331'High dielectric constant structure for the vertical transfer gates of a complementary metal-oxide semiconductor (CMOS) image sensor'2016 9,040,385'Mechanisms for cleaning substrate surface for hybrid bonding'2015

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2015–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (33)· patent assignee history

2015–2018Based in Kaohsiung, TW· patent location history

2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (1)· patent assignee history

2016–2020Based in Tainan, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	33	2015–2020
TAIWAN SEMICONDUCTOR MFG	1	2016

Locations

Location	Patents	Span
Tainan, TW	32	2016–2020
Kaohsiung, TW	2	2015–2018