Inventor

Aleksander Owczarz

Inventor

San Jose, CA, US

Overview

1991–2016

Patent span

Electricity

Primary field (CPC H)

Patents· 69 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1031%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests17%

B24BMachines, devices, or processes for grinding or polishing12%

B08BCleaning in general8%

G11BInformation storage based on relative movement between record carrier and transducer7%

C23CCoating metallic material4%

G01BMeasuring length, thickness or similar linear dimensions4%

B01FMixing, e.g. dissolving, emulsifying or dispersing3%

F04BPositive-displacement machines for liquids3%

G01NInvestigating or analysing materials by determining their chemical or physical properties2%

PatentTitleYear

9,287,110'Method and apparatus for wafer electroless plating'2016 9,117,860'Controlled ambient system for interface engineering'2015 8,844,461'Fluid handling system for wafer electroless plating and associated methods'2014 8,535,451'Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids'2013 8,485,120'Method and apparatus for wafer electroless plating'2013 8,314,027'Wafer electroless plating system and associated methods'2012 8,069,813'Wafer electroless plating system and associated methods'2011 7,780,825'Substrate gripper with integrated electrical contacts'2010 7,752,996'Apparatus for applying a plating solution for electroless deposition'2010 7,625,452'Apparatuses and methods for cleaning a substrate'2009 7,568,490'Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids'2009 7,542,134'System, method and apparatus for in-situ substrate inspection'2009 7,441,299'Apparatuses and methods for cleaning a substrate'2008 7,397,555'System, method and apparatus for in-situ substrate inspection'2008 7,309,618'Method and apparatus for real time metal film thickness measurement'2007 7,205,166'Method and apparatus of arrayed, clustered or coupled eddy current sensor configuration for measuring conductive film properties'2007 7,179,154'Method and apparatus for cleaning a wafer bevel edge and notch using a pin and an abrasive film cassette'2007 7,138,016'Semiconductor processing apparatus'2006 7,128,803'Integration of sensor based metrology into semiconductor processing tools'2006 7,115,023'Process tape for cleaning or processing the edge of a semiconductor wafer'2006 7,094,291'Semiconductor processing apparatus'2006 7,084,621'Enhancement of eddy current based measurement capabilities'2006 7,025,854'Method and apparatus for aligning and setting the axis of rotation of spindles of a multi-body system'2006 6,951,624'Method and apparatus of arrayed sensors for metrological control'2005 6,937,915'Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control'2005 6,929,531'System and method for metal residue detection and mapping within a multi-step sequence'2005 6,925,348'Methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control'2005 6,922,053'Complementary sensors metrological process and method and apparatus for implementing the same'2005 6,902,466'Oscillating chemical mechanical planarization apparatus'2005 6,896,596'Polishing pad ironing system'2005 6,894,491'Method and apparatus for metrological process control implementing complementary sensors'2005 6,808,590'Method and apparatus of arrayed sensors for metrological control'2004 6,808,442'Apparatus for removal/remaining thickness profile manipulation'2004 6,769,961'Chemical mechanical planarization (CMP) apparatus'2004 6,719,874'Active retaining ring support'2004 6,716,299'Profiled retaining ring for chemical mechanical planarization'2004 6,585,572'Subaperture chemical mechanical polishing system'2003 6,579,157'Polishing pad ironing system and method for implementing the same'2003 6,579,407'Method and apparatus for aligning and setting the axis of rotation of spindles of a multi-body system'2003 6,561,870'Adjustable force applying air platen and spindle system, and methods for using the same'2003 6,520,833'Oscillating fixed abrasive CMP system and methods for implementing the same'2003 6,408,863'Seal configuration for use with a motor drive assembly in a microelectronic work piece processing system'2002 6,386,962'Wafer carrier with groove for decoupling retainer ring from water'2002 6,105,592'Gas intake assembly for a wafer processing system'2000 6,098,641'Motor drive assembly for a semiconductor wafer processing system'2000 5,972,127'Methods for centrifugally cleaning wafer carriers'1999 5,738,128'Centrifugal wafer carrier cleaning apparatus'1998 5,575,641'Semiconductor processor opening and closure construction'1996 5,573,023'Single wafer processor apparatus'1996 5,562,113'Centrifugal wafer carrier cleaning apparatus'1996 5,449,289'Semiconductor processor opening and closure construction'1995 5,445,172'Wafer holder with flexibly mounted gripping fingers'1995 5,431,421'Semiconductor processor wafer holder'1995 5,409,310'Semiconductor processor liquid spray system with additive blending'1995 5,377,708'Multi-station semiconductor processor with volatilization'1995 5,357,991'Gas phase semiconductor processor with liquid phase mixing'1994 5,235,995'Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization'1993 5,232,328'Robot loadable centrifugal semiconductor processor with extendible rotor'1993 5,224,503'Centrifugal wafer carrier cleaning apparatus'1993 5,224,841'Pneumatic bellows pump with supported bellows tube'1993 5,222,310'Single wafer processor with a frame'1993 5,221,360'Semiconductor processor methods'1993 5,174,045'Semiconductor processor with extendible receiver for handling multiple discrete wafers without wafer carriers'1992 5,168,887'Single wafer processor apparatus'1992 5,156,174'Single wafer processor with a bowl'1992 5,154,199'Semiconductor processor draining'1992 5,095,927'Semiconductor processor gas-liquid separation'1992 5,085,560'Low contamination blending and metering systems for semiconductor processing'1992 5,022,419'Rinser dryer system'1991

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1991–2006Patents assigned to SEMITOOL INC (28)· patent assignee history

1991–1999Based in Kalispell, MT, US· patent location history

2000–2002Based in Fremont, CA, US· patent location history

2002–2016Patents assigned to LAM RES CORP (40)· patent assignee history

2002–2016Based in San Jose, CA, US· patent location history

2011–2015Patents assigned to OWCZARZ ALEKSANDER (6)· patent assignee history

2011–2015Patents assigned to ARUNAGIRI TIRUCHIRAPALLI (5)· patent assignee history

2011–2015Patents assigned to DORDI YEZDI (5)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
LAM RES CORP	40	2002–2016
SEMITOOL INC	28	1991–2006
OWCZARZ ALEKSANDERself	6	2011–2015
ARUNAGIRI TIRUCHIRAPALLI	5	2011–2015
DORDI YEZDI	5	2011–2015

Locations

Location	Patents	Span
San Jose, California, US	42	2002–2016
Kalispell, MT, US	24	1991–1999
Fremont, California, US	3	2000–2002