Inventor
Tsutomu Asai
Inventor
Ageo, JP
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits21%
Y10TTechnical subjects covered by former us classification21%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form9%
C08LCompositions of macromolecular compounds6%
C25DProcesses for the electrolytic or electrophoretic production of coatings6%
G09GArrangements or circuits for control of indicating devices using static means to present variable information6%
H04NPictorial communication, e.g. television6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
A63BApparatus for physical training, gymnastics, swimming, climbing, or fencing3%
B23KSoldering or unsoldering3%
PatentTitleYear
10,728,467Audio/video output device202010,440,289Audio/video output device20198,411,549'Circuit for preventing destruction of semiconductor laser element, and optical disc device provided with the circuit'20136,831,129'Resin-coated copper foil, and printed wiring board using resin-coated copper foil'20046,716,530'RESIN COMPOUND FOR FABRICATING INTERLAYER DIELECTRIC OF PRINTED WIRING BOARD, RESIN SHEET AND RESIN APPLIED-COPPER FOIL FOR FORMING INSULATION LAYER USING THE RESIN COMPOUND, AND COPPER-CLAD LAMINATE USING THEM'20046,652,962'Resin-coated composite foil, production and use thereof'20036,240,636'Method for producing vias in the manufacture of printed circuit boards'20016,194,056'High tensile strength electrodeposited copper foil'20016,187,416'Resin composition for copper-clad laminate, resin-coated copper foil, multilayered copper-clad laminate, and multilayered printed circuit board'20015,958,209'High tensile strength electrodeposited copper foil and process of electrodepositing thereof'19995,309,041'Nutating step motor'1994Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994–2013Patents assigned to ASAI TSUTOMU (2)· patent assignee history
1994Patents assigned to ASAOKA KEIICHIRO (1)· patent assignee history
1994Patents assigned to KAWAI TERUO (1)· patent assignee history
1994Based in Nerima-ku, JP· patent location history
1999–2004Patents assigned to MITSUI MINING & SMELTING CO (7)· patent assignee history
1999–2004Based in Ageo, JP· patent location history
2001Based in Tokyo, JP· patent location history
2013–2020Patents assigned to FUNAI ELECTRIC CO (3)· patent assignee history
2013Based in Osaka, JP· patent location history
2019–2020Based in Hirakata, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUI MINING & SMELTING CO | 7 | 1999–2004 |
| FUNAI ELECTRIC CO | 3 | 2013–2020 |
| ASAI TSUTOMUself | 2 | 1994–2013 |
| ASAOKA KEIICHIRO | 1 | 1994 |
| KAWAI TERUO | 1 | 1994 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ageo, JP | 6 | 1999–2004 |
| Hirakata, JP | 2 | 2019–2020 |
| Osaka, JP | 1 | 2013 |
| Tokyo, JP | 1 | 2001 |
| Nerima-ku, JP | 1 | 1994 |