Inventor

Wei-Che Hsiao

Inventor

Tainan, TW

Overview

2019–2020

Patent span

Mechanical engineering

Primary field (CPC F)

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits27%

F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact18%

F28FDetails of heat-exchange and heat-transfer apparatus, of general application18%

F16BDevices for fastening or securing constructional elements or machine parts together, e.g. nails, bolts, circlips, clamps, clips or wedges9%

G06FElectric digital data processing9%

H01LSemiconductor devices9%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%

PatentTitleYear

Assembled from patent assignee/location history and declaration credentials.

2019Patents assigned to MAN ZAI IND CO LTD (2)· patent assignee history

2019Based in Tainan, TW· patent location history

2020Patents assigned to LENOVO ENTPR SOLUTIONS SINGAPORE PTE LTD (1)· patent assignee history

2020Based in Taipei, TW· patent location history

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MAN ZAI IND CO LTD	2	2019
LENOVO ENTPR SOLUTIONS SINGAPORE PTE LTD	1	2020

Locations

Location	Patents	Span
Tainan, TW	2	2019
Taipei, TW	1	2020