Inventor
CARLTON HANNA
Inventor
US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H05KPrinted circuits15%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
PatentTitleYear
12,538,797Substrate for improved heat dissipation and method202612,476,176Glass core substrate printed circuit board for warpage reduction202512,374,625Microelectronic assemblies having topside power delivery structures202512,243,828Microelectronic assemblies having topside power delivery structures202512,211,796Microelectronic assemblies having topside power delivery structures2025Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2025–2026Patents assigned to INTEL CORP (5)· patent assignee history
2025–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 5 | 2025–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 5 | 2025–2026 |