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Inventor

Noriyuki Sakuma

Inventor
Hachioji, JP

Overview

52→
Patents
1987–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 52 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
B24BMachines, devices, or processes for grinding or polishing10%
G01FMeasuring volume, volume flow, mass flow or liquid level9%
C09GPolishing compositions8%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock7%
C09KMaterials for miscellaneous applications, not provided for elsewhere6%
B81BMicrostructural devices or systems, e.g. micromechanical devices5%
C23FNon-mechanical removal of metallic material from surface5%
Y10TTechnical subjects covered by former us classification4%
PatentTitleYear
10,802,040Acceleration sensor202010,802,041Acceleration sensor202010,739,376Acceleration sensor202010,697,995Acceleration sensor including improved mass body202010,527,643Inertia sensor with improved detection sensitivity using servo voltage to detect a physical quantity202010,527,642Acceleration sensor202010,502,758Inertia sensor and method of manufacturing the same201910,393,557Thermal fluid flow sensor201910,160,644Manufacturing method of MEMS sensor20189,958,472Inertial sensor20189,851,233Physical quantity sensor20179,766,106'Thermal air flow sensor'20179,719,824'Thermal air flow sensor'20179,379,302'Method of manufacturing the thermal fluid flow sensor'20168,714,008'Thermal fluid flow sensor and method of manufacturing the same'20148,468,883'Thermal type flow sensor having a humidity detection portion and an air flow detecting portion'20138,429,964'Thermal fluid flow sensor having stacked insulating films above and below heater and temperature-measuring resistive elements'2013RE043660'Flow sensor using a heat element and a resistance temperature detector formed of a metal film'20127,886,594'Thermal type fluid flow sensor with metal film resistor'20117,816,702'Semiconductor device'20107,673,508'Thermal type fluid flow sensor'20107,621,180'Flow sensor with metal film resistor'20097,563,716'Polishing method'20097,404,320'Flow sensor using a heat element and a resistance temperature detector formed of a metal film'20087,279,425'Polishing method'20077,183,212'Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device'20077,132,367'Polishing method'20067,054,956'Multi-interval data acquisition apparatus'20066,905,571'Wafer polishing method and wafer polishing apparatus in semiconductor fabrication equipment'20056,899,603'Polishing apparatus'20056,864,584'Semiconductor device'20056,855,035'Apparatus and method for producing substrate with electrical wire thereon'20056,815,357'Process and apparatus for manufacturing a semiconductor device'20046,774,041'Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device'20046,750,128'Methods of polishing, interconnect-fabrication, and producing semiconductor devices'20046,719,618'Polishing apparatus'20046,680,541'Semiconductor device and process for producing the same'20046,638,854'Semiconductor device and method for manufacturing the same'20036,596,638'Polishing method'20036,565,422'Polishing apparatus using substantially abrasive-free liquid with mixture unit near polishing unit, and plant using the polishing apparatus'20036,561,883'Method of polishing'20036,561,875'Apparatus and method for producing substrate with electrical wire thereon'20036,562,719'Methods of polishing, interconnect-fabrication, and producing semiconductor devices'20036,358,838'Semiconductor device and process for producing the same'20026,326,299'Method for manufacturing a semiconductor device'20016,117,775'Polishing method'20005,832,420'Data collection apparatus'19985,079,191'Process for producing a semiconductor device'19924,937,650'Semiconductor capacitor device with dual dielectric'19904,891,684'Semiconductor device'19904,809,052'Semiconductor memory device'19894,636,833'Semiconductor device'1987

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1987–2020Patents assigned to HITACHI LTD (33)· patent assignee history
1987–2007Based in Hachioji, JP· patent location history
1990–2020Based in Tokyo, JP· patent location history
2000–2009Based in Hachiouji, JP· patent location history
2002–2004Patents assigned to HITACHI ULSI SYS CO LTD (2)· patent assignee history
2004–2009Patents assigned to RENESAS TECH CORP (8)· patent assignee history
2006Based in Musashino, JP· patent location history
2008–2016Based in Kodaira, JP· patent location history
2012–2017Patents assigned to SAKUMA NORIYUKI (5)· patent assignee history
2013–2019Patents assigned to HITACHI AUTOMOTIVE SYSTEMS LTD (8)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HITACHI LTD331987–2020
HITACHI AUTOMOTIVE SYSTEMS LTD82013–2019
RENESAS TECH CORP82004–2009
SAKUMA NORIYUKIself52012–2017
HITACHI ULSI SYS CO LTD22002–2004
Locations
LocationPatentsSpan
Hachioji, JP191987–2007
Tokyo, JP171990–2020
Kodaira, JP102008–2016
Hachiouji, JP52000–2009
Musashino, JP12006