Inventor
Rainer Pelzer
Inventor
Wernberg, AT
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices31%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
B81BMicrostructural devices or systems, e.g. micromechanical devices19%
B23KSoldering or unsoldering6%
G02BOptical elements, systems or apparatus6%
H01RElectrically-conductive connections6%
PatentTitleYear
11,127,693Barrier for power metallization in semiconductor devices202110,734,320Power metallization structure for semiconductor devices202010,700,019Semiconductor device with compressive interlayer202010,658,309Semiconductor device with compressive interlayer202010,304,782Compressive interlayer having a defined crack-stop edge extension20198,884,407'Devices for providing an electrical connection'2014Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014–2021Patents assigned to INFINEON TECHNOLOGIES AG (4)· patent assignee history
2014Based in Villach, AT· patent location history
2019–2021Based in Wernberg, AT· patent location history
2020Patents assigned to INFINEON TECHNOLOGIES AUSTRIA AG (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 4 | 2014–2021 |
| INFINEON TECHNOLOGIES AUSTRIA AG | 1 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Wernberg, AT | 5 | 2019–2021 |
| Villach, AT | 1 | 2014 |