Inventor
Khay Chwan Andrew Saw
Inventor
MY
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
PatentTitleYear
12,300,559Semiconductor packages and methods for manufacturing thereof202512,176,222Semiconductor package with metal posts from structured leadframe202412,021,000Semiconductor package and method for fabricating a semiconductor package202411,587,800Semiconductor package with lead tip inspection feature2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2025Patents assigned to INFINEON TECHNOLOGIES AG (4)· patent assignee history
2023–2025Based in MY· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 4 | 2023–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| MY | 4 | 2023–2025 |