Inventor

Jayaganasan Narayanasamy

Inventor

Melaka, MY

Overview

3→

Patents

2018–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices33%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%

B29CShaping or joining of plastics11%

B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts11%

B29LIndexing scheme associated with subclass b29c, relating to particular articles11%

PatentTitleYear

10,651,109Selective plating of semiconductor package leads2020 10,457,001Method for forming a matrix composite layer and workpiece with a matrix composite layer2019 10,121,723Semiconductor component and method for producing a semiconductor component2018

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2018Patents assigned to INFINEON TECHNOLOGIES AUSTRIA AG (1)· patent assignee history

2018–2020Based in Melaka, MY· patent location history

2019–2020Patents assigned to INFINEON TECHNOLOGIES AG (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
INFINEON TECHNOLOGIES AG	2	2019–2020
INFINEON TECHNOLOGIES AUSTRIA AG	1	2018

Locations

Location	Patents	Span
Melaka, MY	3	2018–2020