Inventor
Hikaru Nomura
Inventor
Tokyo, JP
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering24%
C22CAlloys24%
H05KPrinted circuits16%
Y10TTechnical subjects covered by former us classification12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
G01QScanning-probe techniques or apparatus4%
H01BCables4%
H01LSemiconductor devices4%
Y02PClimate change mitigation technologies in the production or processing of goods4%
PatentTitleYear
10,500,680Solder alloy, solder ball, and solder joint201910,343,238Lead-free solder alloy201910,213,879Solder alloy201910,076,808Lead-free solder alloy20189,907,155'Printed wiring board and printed circuit board'20189,808,890'Solder alloy'20179,780,055'Lead-free solder ball'20179,482,692'Magnetic field value measuring device and method for measuring magnetic field value'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016Patents assigned to UNIV AKITA (1)· patent assignee history
2016Based in Suita, JP· patent location history
2017–2019Patents assigned to SENJU METAL INDUSTRY CO (6)· patent assignee history
2017Patents assigned to NOMURA Hikaru (1)· patent assignee history
2017Patents assigned to TACHIBANA KEN (1)· patent assignee history
2017–2019Based in Tokyo, JP· patent location history
2017Based in Saitama, JP· patent location history
2018Patents assigned to CANON KK (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SENJU METAL INDUSTRY CO | 6 | 2017–2019 |
| CANON KK | 1 | 2018 |
| NOMURA Hikaruself | 1 | 2017 |
| TACHIBANA KEN | 1 | 2017 |
| UNIV AKITA | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 6 | 2017–2019 |
| Saitama, JP | 1 | 2017 |
| Suita, JP | 1 | 2016 |