Inventor
Li-Chi Pan
Inventor
Hsinchu County, TW
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
G01RMeasuring electric variables7%
H01LSemiconductor devices7%
H10NElectric solid-state devices not otherwise provided for7%
B81BMicrostructural devices or systems, e.g. micromechanical devices5%
G06FElectric digital data processing5%
H03HImpedance networks, e.g. resonant circuits5%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers5%
H04WWireless communication networks5%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation5%
PatentTitleYear
11,032,864Method and apparatus for handling multiple sidelink communication in a wireless communication system202111,019,670Method and apparatus for sidelink signaling radio bearer (SRB) establishment in a wireless communication system20219,523,752'Interface for medical imaging device'20169,343,651'Organic packaging carrier'20169,275,294'Compressed sensing using regional sparsity'20169,236,275'MEMS acoustic transducer and method for fabricating the same'20169,133,018'Structure and fabrication method of a sensing device'20159,086,227'Method and system for light collection and light energy converting apparatus'20158,863,105'Automatic control system and method for executing control program in parallel'20148,763,457'Sensing device and manufacturing method thereof'20148,693,711'Capacitive transducer and fabrication method'20148,421,216'Vacuum hermetic organic packaging carrier'20138,314,666'Resonator, elastic wave transmission element and fabrication method thereof'20127,989,948'Chip package structure and method of fabricating the same'20117,973,454'Vacuum hermetic organic packaging carrier and sensor device package'20117,560,926'b-value optimization for diffusion weighted magnetic resonance imaging'2009D0573108'Numeric controller panel'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2016Patents assigned to SIEMENS AG (4)· patent assignee history
2009–2016Based in Perry Hall, MD, US· patent location history
2011–2016Patents assigned to IND TECH RES INST (10)· patent assignee history
2011–2016Based in Hsinchu County, TW· patent location history
2011–2015Based in Hsinchu, TW· patent location history
2012–2016Patents assigned to PAN LI-CHI (7)· patent assignee history
2013–2016Patents assigned to CHEN LUNG-TAI (5)· patent assignee history
2013–2016Patents assigned to HO TZONG-CHE (5)· patent assignee history
2014Based in Beijing, CN· patent location history
2021Based in Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IND TECH RES INST | 10 | 2011–2016 |
| PAN LI-CHIself | 7 | 2012–2016 |
| CHEN LUNG-TAI | 5 | 2013–2016 |
| HO TZONG-CHE | 5 | 2013–2016 |
| SIEMENS AG | 4 | 2008–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu County, TW | 7 | 2011–2016 |
| Perry Hall, Maryland, US | 3 | 2009–2016 |
| Taipei, TW | 2 | 2021 |
| Hsinchu, TW | 2 | 2011–2015 |
| Beijing, CN | 1 | 2014 |