LexDanaLexDanabeta
Inventor

En-Chieh Wu

Inventor
Kaohsiung, TW

Overview

3→
Patents
2006–2008
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1075%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
PatentTitleYear
7,402,510'Etchant and method for forming bumps'20087,261,828'Bumping process'20077,015,130'Method for making UBM pads and bumps on wafer'2006

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2006–2008Patents assigned to ADVANCED SEMICONDUCTOR ENG (3)· patent assignee history
2006–2008Based in Kaohsiung, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ADVANCED SEMICONDUCTOR ENG32006–2008
Locations
LocationPatentsSpan
Kaohsiung, TW32006–2008