Inventor
Howard D. Knuth
Inventor
Tempe, AZ, US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H03HImpedance networks, e.g. resonant circuits17%
Y10TTechnical subjects covered by former us classification17%
C23CCoating metallic material8%
H01PWaveguides8%
PatentTitleYear
5,414,214'Resistance heated, sealed microfabricated device package method and apparatus'19955,406,034'Circuit board having stepped vias'19955,361,967'Monolithic circuit fabrication method'19945,341,115'Reinforced wrap around ground and method'19945,296,736'Leveled non-coplanar semiconductor die contacts'19944,601,915'Method of fabricating air supported crossovers'1986Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1986–1995Patents assigned to MOTOROLA INC (6)· patent assignee history
1986–1995Based in Tempe, AZ, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MOTOROLA INC | 6 | 1986–1995 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tempe, AZ, US | 6 | 1986–1995 |