Inventor
Takahito Nakazawa
Inventor
Yokohama, JP
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
B05BSpraying apparatus13%
B05CApparatus for applying fluent materials to surfaces, in general13%
Y10TTechnical subjects covered by former us classification13%
B29CShaping or joining of plastics8%
PatentTitleYear
8,241,999'Semiconductor device having a protection pattern with two element separation regions'20126,774,011'Chip pickup device and method of manufacturing semiconductor device'20046,448,665'Semiconductor package and manufacturing method thereof'20026,379,484'Method for manufacturing a semiconductor package'20026,191,024'Apparatus and method for manufacturing a semiconductor package'20016,011,312'Flip-chip semiconductor package'20005,998,243'Method for manufacturing semiconductor device and apparatus for resin-encapsulating'19995,935,375'Apparatus and method for manufacturing a semiconductor package'19995,677,246'Method of manufacturing semiconductor devices'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2012Patents assigned to TOSHIBA KK (9)· patent assignee history
1997–2004Based in Yokohama, JP· patent location history
2012Patents assigned to IKEDA TAKAFUMI (1)· patent assignee history
2012Patents assigned to MAEKAWA HIDEAKI (1)· patent assignee history
2012Patents assigned to MINAMI TOSHIFUMI (1)· patent assignee history
2012Patents assigned to NAKAZAWA TAKAHITO (1)· patent assignee history
2012Based in Funabashi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOSHIBA KK | 9 | 1997–2012 |
| IKEDA TAKAFUMI | 1 | 2012 |
| MAEKAWA HIDEAKI | 1 | 2012 |
| MINAMI TOSHIFUMI | 1 | 2012 |
| NAKAZAWA TAKAHITOself | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Yokohama, JP | 8 | 1997–2004 |
| Funabashi, JP | 1 | 2012 |