Inventor
Rahul Surana
Inventor
Fremont, CA, US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing43%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
B24DTools for grinding, buffing or sharpening14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
G01NInvestigating or analysing materials by determining their chemical or physical properties7%
PatentTitleYear
7,848,839'System, method, and medium for an endpoint detection scheme for copper low-dielectric damascene structures for improved dielectric and copper loss'20107,354,332'Technique for process-qualifying a semiconductor manufacturing tool using metrology data'20086,960,521'Method and apparatus for polishing metal and dielectric substrates'20056,790,768'Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects'20046,254,459'Wafer polishing device with movable window'20016,068,539'Wafer polishing device with movable window'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2001Patents assigned to LAM RES CORP (2)· patent assignee history
2000–2008Based in Fremont, CA, US· patent location history
2004–2010Patents assigned to APPLIED MATERIALS INC (4)· patent assignee history
2010Based in Freemont, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 4 | 2004–2010 |
| LAM RES CORP | 2 | 2000–2001 |
Locations
| Location | Patents | Span |
|---|---|---|
| Fremont, California, US | 5 | 2000–2008 |
| Freemont, California, US | 1 | 2010 |