Inventor
JEONGHOON OH
Inventor
US
Overview
Patents· 33 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing35%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%
H01LSemiconductor devices17%
C23CCoating metallic material4%
H01JElectric discharge tubes or discharge lamps4%
Y10TTechnical subjects covered by former us classification4%
B25JManipulators1%
G01DMeasuring not specially adapted for a specific variable1%
G01HMeasurement of mechanical vibrations or ultrasonic, sonic or infrasonic waves1%
G05BControl or regulating systems in general1%
PatentTitleYear
12,459,078In-situ conditioner disk cleaning during CMP202512,454,036Substrate handling systems and methods for CMP processing202512,447,579Chemical mechanical polishing vibration measurement using optical sensor202512,434,348Retaining ring having inner surfaces with features202512,403,561Eddy current monitoring to detect vibration in polishing202512,337,439Multiple disk pad conditioner202512,048,981Retaining ring having inner surfaces with features202412,036,635Methods of detecting non-conforming substrate processing events during chemical mechanical polishing202412,033,865Retaining ring having inner surfaces with facets202411,911,869Chemical mechanical polishing system with platen temperature control202411,890,717Polishing system with platen for substrate edge control202411,850,700Sequential application of cleaning fluids for improved maintenance of chemical mechanical polishing systems202311,850,703Method of forming retaining ring with shaped surface202311,780,046Polishing system with annular platen or polishing pad202311,768,984Parameter sensing and computer modeling for gas delivery health monitoring202311,764,069Asymmetry correction via variable relative velocity of a wafer202311,717,936Methods for a web-based CMP system202311,701,749Monitoring of vibrations during chemical mechanical polishing202311,682,561Retaining ring having inner surfaces with facets202311,673,226Retaining ring for CMP202311,621,152Methods and apparatus for processing a substrate using improved shield configurations202311,597,052Temperature control of chemical mechanical polishing202311,577,361Retaining ring with shaped surface and method of forming202311,511,388Polishing system with support post and annular platen or polishing pad202211,508,563Methods and apparatus for processing a substrate using improved shield configurations202211,469,080Magnetron assembly having coolant guide for enhanced target cooling202211,453,099Retaining ring having inner surfaces with features202211,440,159Edge load ring202211,400,560Retaining ring design202211,370,079Reinforcement ring for carrier head with flexible membrane202211,338,409Three-zone carrier head and flexible membrane202211,260,500Retaining ring with shaped surface202211,241,769Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to APPLIED MATERIALS INC (33)· patent assignee history
2022–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 33 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 33 | 2022–2025 |