Inventor

Noriyuki Fujimori

Inventor
Suwa, JP

Overview

51→
Patents
2006–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 51 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

A61Bprimary
A61BDiagnosis26%
H04NPictorial communication, e.g. television17%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation14%
H01LSemiconductor devices11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
G02BOptical elements, systems or apparatus8%
H05KPrinted circuits4%
Y10TTechnical subjects covered by former us classification4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
PatentTitleYear
11,109,749Endoscope202110,631,719Endoscope202010,582,098Image pickup apparatus202010,542,874Imaging device and endoscope device202010,492,672Image pick up unit for endoscope and endoscope201910,456,022Imaging device, endoscope, and endoscope system201910,440,243Image pickup apparatus201910,281,710Imaging module and endoscope apparatus each having a flexible substrate divided into different regions where a chip having a transmission buffer and a drive signal cable are connected to the different regions201910,249,672Image pickup apparatus, semiconductor apparatus, and image pickup unit201910,188,269Manufacturing method for image pickup unit and image pickup unit201910,153,311Image sensor201810,015,375Image pickup apparatus and endoscope including the same20189,895,053'Capsule type medical device'20189,820,637'Image pickup apparatus and endoscope including image pickup apparatus'20179,698,195'Method for producing image pickup apparatus and method for producing semiconductor apparatus'20179,693,460'Wiring board, manufacturing method for wiring board, and image pickup apparatus'20179,681,067'Manufacturing method for image pickup unit and image pickup unit'20179,520,428'Image pickup apparatus'20169,486,127'Capsule type medical device'20169,281,423'Image pickup apparatus, endoscope and image pickup apparatus manufacturing method'20169,282,261'Method for producing image pickup apparatus and method for producing semiconductor apparatus'20169,240,398'Method for producing image pickup apparatus and method for producing semiconductor apparatus'20169,230,939'Method for producing image pickup apparatus, method for producing semiconductor apparatus, and joined wafer'20169,123,618'Method for producing image pickup apparatus, and method for producing semiconductor apparatus'20158,947,594'Image pickup unit and method of manufacturing the same'20158,823,859'Image pickup unit, optical unit, and manufacturing method for the image pickup unit'20148,754,982'Image pickup unit and method of manufacturing the same'20148,602,977'Capsule-type medical apparatus'20138,449,458'Body-insertable apparatus and radio in-vivo information acquiring system'20138,348,835'Capsule type endoscope'20138,246,537'Capsular endoscope'20128,228,369'Endoscope apparatus'20128,179,429'Body-insertable apparatus and body-insertable apparatus system'20128,177,712'Body insertable apparatus and body-insertable apparatus system'20128,152,713'Capsule endoscope with illumination board section and method of assembling'20128,123,677'Body-insertable apparatus'20128,038,599'Wireless in-vivo information acquiring apparatus, wireless in-vivo information acquiring system, and communication apparatus'20118,041,422'In-body information acquiring apparatus and power-supply circuit'20118,038,607'Body insertable apparatus with a plurality of imaging blocks'20117,998,059'Endoscopic imaging apparatus and capsule-type endoscope'20117,993,265'In-vivo image acquiring system and body-insertable apparatus'20117,959,562'Body-insertable apparatus, in-vivo information acquiring system, and body-insertable apparatus manufacturing method'20117,946,983'Body-insertable apparatus and power supplying method therefor'20117,898,085'Solid-state imaging device and manufacturing method thereof'20117,881,668'Receiving apparatus for swallow-type capsule endoscope'20117,864,007'Capsule medical apparatus and current-carrying control method'20117,785,024'Imaging apparatus and method of manufacturing the same'20107,775,971'Capsule apparatus with rigid and flexible wiring board sections'20107,675,394'Capsule medical apparatus and current-carrying control method'20107,316,647'Capsule endoscope and a capsule endoscope system'20087,091,599'Solid-state imaging device'2006

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2006–2021Patents assigned to OLYMPUS CORP (49)· patent assignee history
2006–2021Based in Suwa, JP· patent location history
2008–2013Based in Tokyo, JP· patent location history
2010–2012Patents assigned to OLYMPUS MEDICAL SYSTEMS CORP (7)· patent assignee history
2010–2013Based in Nagano, JP· patent location history
2012–2014Patents assigned to FUJIMORI NORIYUKI (11)· patent assignee history
2012–2013Patents assigned to HONDA TAKEMITSU (3)· patent assignee history
2012–2013Patents assigned to SUZUSHIMA HIROSHI (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
OLYMPUS CORP492006–2021
FUJIMORI NORIYUKIself112012–2014
OLYMPUS MEDICAL SYSTEMS CORP72010–2012
HONDA TAKEMITSU32012–2013
SUZUSHIMA HIROSHI32012–2013
Locations
LocationPatentsSpan
Suwa, JP372006–2021
Nagano, JP112010–2013
Tokyo, JP32008–2013