Inventor
Anne E. Sanderfer
Inventor
Campbell, CA, US
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1047%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests12%
C11DDetergent compositions6%
C23FNon-mechanical removal of metallic material from surface6%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices6%
PatentTitleYear
6,642,152'Method for ultra thin resist linewidth reduction using implantation'20036,387,820'BC13/AR chemistry for metal overetching on a high density plasma etcher'20026,333,263'Method of reducing stress corrosion induced voiding of patterned metal layers'20016,297,065'Method to rework device with faulty metal stack layer'20016,274,504'Minimizing metal corrosion during post metal solvent clean'20016,251,776'Plasma treatment to reduce stress corrosion induced voiding of patterned metal layers'20016,174,819'Low temperature photoresist removal for rework during metal mask formation'20016,159,863'Insitu hardmask and metal etch in a single etcher'20006,066,546'Method to minimize particulate induced clamping failures'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2003Patents assigned to ADVANCED MICRO DEVICES INC (9)· patent assignee history
2000–2003Based in Campbell, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED MICRO DEVICES INC | 9 | 2000–2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Campbell, California, US | 9 | 2000–2003 |