Inventor

Ryosuke Kimoto

Inventor

Hamura, JP

Overview

1996–2008

Patent span

Electricity

Primary field (CPC H)

Patents· 25 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1051%

Y10TTechnical subjects covered by former us classification33%

H05KPrinted circuits12%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%

PatentTitleYear

7,420,284'Semiconductor device and manufacturing method thereof'2008 7,332,800'Semiconductor device'2008 7,217,645'Method for manufacturing semiconductor device and electronic device and method for calculating connection condition'2007 7,211,892'Semiconductor device having a particular electrode structure'2007 7,091,620'Semiconductor device and manufacturing method thereof'2006 6,879,041'Semiconductor device with joint structure having lead-free solder layer over nickel layer'2005 6,670,215'Semiconductor device and manufacturing method thereof'2003 6,664,135'Method of manufacturing a ball grid array type semiconductor package'2003 6,642,083'Semiconductor device and manufacturing method thereof'2003 6,521,981'Semiconductor device and manufacturing method thereof'2003 6,476,467'Semiconductor device and process for producing the same'2002 6,472,727'Semiconductor device and manufacturing method thereof'2002 6,400,020'Aggregate of semiconductor devices including semiconductor packages arranged on a first tape and wound on a reel and also including a spacer tape provided with spacers'2002 6,365,439'Method of manufacturing a ball grid array type semiconductor package'2002 6,355,500'Semiconductor device and manufacturing method thereof'2002 6,355,975'Semiconductor device and manufacturing method thereof'2002 6,353,255'Semiconductor device and manufacturing method thereof'2002 6,342,726'Semiconductor device and manufacturing method thereof'2002 6,342,728'Semiconductor device and manufacturing method thereof'2002 6,278,176'Semiconductor device and process for producing the same'2001 6,146,920'Bump formation method'2000 6,060,770'Semiconductor device and process for producing the same'2000 5,869,888'Semiconductor device with lead structure on principal surface of chip'1999 5,714,405'Semiconductor device'1998 5,583,375'Semiconductor device with lead structure within the planar area of the device'1996

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1996–2007Patents assigned to HITACHI LTD (18)· patent assignee history

1996–2000Patents assigned to HITACHI MICROCOMPUTER SYST (3)· patent assignee history

1996–1999Based in Tachikawa, JP· patent location history

2000–2005Patents assigned to HITACHI ULSI SYS CO LTD (5)· patent assignee history

2000–2008Based in Hamura, JP· patent location history

2002–2003Patents assigned to HITACHI MICROCOMP SYSTEMS LTD (2)· patent assignee history

2003–2008Patents assigned to RENESAS TECH CORP (6)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HITACHI LTD	18	1996–2007
RENESAS TECH CORP	6	2003–2008
HITACHI ULSI SYS CO LTD	5	2000–2005
HITACHI MICROCOMPUTER SYST	3	1996–2000
HITACHI MICROCOMP SYSTEMS LTD	2	2002–2003

Locations

Location	Patents	Span
Hamura, JP	22	2000–2008
Tachikawa, JP	3	1996–1999