Inventor
Raj K. Bansal
Inventor
Taichung, TW
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices8%
G11CStatic stores8%
PatentTitleYear
11,081,468Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding and related methods, devices and apparatuses202110,943,841Substrates, structures within a scribe-line area of a substrate, and methods of forming a conductive line of a redistribution layer of a substrate and of forming a structure within a scribe-line area of the substrate202110,847,482Integrated circuit structures and methods of forming an opening in a material202010,651,100Substrates, structures within a scribe-line area of a substrate, and methods of forming a conductive line of a redistribution layer of a substrate and of forming a structure within a scribe-line area of the substrate2020Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2020–2021Patents assigned to MICRON TECHNOLOGY INC (4)· patent assignee history
2020–2021Based in Taichung, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 4 | 2020–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taichung, TW | 4 | 2020–2021 |