Inventor
Hidehisa Sakai
Inventor
Kawasaki, JP
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing28%
G01NInvestigating or analysing materials by determining their chemical or physical properties12%
H01RElectrically-conductive connections12%
H05KPrinted circuits12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
Y10TTechnical subjects covered by former us classification8%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact4%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application4%
G06TImage data processing or generation, in general4%
H01LSemiconductor devices4%
PatentTitleYear
10,575,392Cooling system20209,990,445Decoupled parallel meshing in computer aided design20189,471,716'Setting method and information processing apparatus'20168,816,510'Semiconductor apparatus, substrate design method, and substrate design apparatus'20148,204,699'Analyzing apparatus, analyzing method, and computer-readable recording medium storing an analyzing program'20128,190,378'Crack growth evaluation apparatus, crack growth evaluation method, and recording medium recording crack growth evaluation program'20127,873,501'Crack growth evaluation apparatus, crack growth evaluation method, and recording medium recording crack growth evaluation program'20117,773,814'Multi-scale analysis device'20107,725,866'Electronic package evaluation apparatus, electronic package optimizing apparatus, and computer-readable recording medium in which electronic package evaluation program is recorded'20107,467,076'Apparatus for predicting reliability in electronic device package, program for predicting reliability in electronic device package, and method for predicting reliability in electronic device package'20087,139,678'Method and apparatus for predicting board deformation, and computer product'20065,738,550'Press-fit pin fitting in a miniaturized through hole formed in a circuit board'19985,475,922'Method of assembling a connector using frangible contact parts'19955,354,209'Connector and method of assembling the same'1994Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994–2020Patents assigned to FUJITSU LTD (14)· patent assignee history
1994–2018Based in Kawasaki, JP· patent location history
2012–2014Patents assigned to SAKAI HIDEHISA (3)· patent assignee history
2012Patents assigned to IIKAWA TSUTOMU (1)· patent assignee history
2012Patents assigned to MORIMUNE KATSUFUMI (1)· patent assignee history
2014Patents assigned to MATSUI NORIYUKI (1)· patent assignee history
2016–2020Based in Sagamihara, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJITSU LTD | 14 | 1994–2020 |
| SAKAI HIDEHISAself | 3 | 2012–2014 |
| IIKAWA TSUTOMU | 1 | 2012 |
| MATSUI NORIYUKI | 1 | 2014 |
| MORIMUNE KATSUFUMI | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kawasaki, JP | 12 | 1994–2018 |
| Sagamihara, JP | 2 | 2016–2020 |