Inventor
TZU-MING OU YANG
Inventor
TW
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Bprimary
H10BElectronic memory devices29%
H01LSemiconductor devices26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
H10DInorganic electric semiconductor devices12%
G11CStatic stores2%
PatentTitleYear
12,568,616Method for forming memory patterns and wire patterns simultaneously202612,408,320Semiconductor structure and method of manufacturing the same202512,322,698Semiconductor memory structure and method for forming the same202512,262,528Manufacturing method of memory structure202512,206,010Method for forming a semiconductor structure202512,193,214Manufacturing method for memory structure202512,144,165Dynamic random access memory having word line buried in chop structure with different widths202411,683,926Method of manufacturing semiconductor structure202311,664,438Semiconductor structure and method for forming the same202311,631,642Method for manufacturing semiconductor device202311,610,897Landing pad structure202311,557,595Memory device202311,527,537Memory structure and manufacturing method thereof202211,527,475Memory devices and methods for forming the same202211,417,666Dynamic random access memory and method of manufacturing the same202211,404,422DRAM semiconductor device having reduced parasitic capacitance between capacitor contacts and bit line structures and method for manufacturing the same202211,342,332Memory structure and manufacturing method therefor202211,289,493Patterning method202211,217,527Semiconductor device and manufacturing method of the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to WINBOND ELECTRONICS CORP (19)· patent assignee history
2022–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| WINBOND ELECTRONICS CORP | 19 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 19 | 2022–2026 |