Inventor

Masato Ishibashi

Inventor
Tokyo, JP

Overview

10→
Patents
1993–2016
Patent span
Performing operations
Primary field (CPC B)

Patents· 10 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Dprimary
H10DInorganic electric semiconductor devices12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
B29CShaping or joining of plastics8%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form8%
B60NSeats specially adapted for vehicles8%
B62DMotor vehicles8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
Y10TTechnical subjects covered by former us classification8%
B29BPreparation or pretreatment of the material to be shaped4%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts4%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1993–2014Patents assigned to HONDA MOTOR CO LTD (5)· patent assignee history
1993–2013Based in Saitama, JP· patent location history
2000–2014Based in Wako, JP· patent location history
2004–2007Based in Dublin, OH, US· patent location history
2007Patents assigned to HAYASHI TELEMPU KK (1)· patent assignee history
2010–2013Based in Tokyo, JP· patent location history
2011–2013Patents assigned to RENESAS ELECTRONICS CORP (2)· patent assignee history
2013–2014Patents assigned to ISHIBASHI MASATO (3)· patent assignee history
2013Patents assigned to HAYASHI RIE (1)· patent assignee history
2016Based in Nagaokakyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HONDA MOTOR CO LTD51993–2014
ISHIBASHI MASATOself32013–2014
RENESAS ELECTRONICS CORP22011–2013
HAYASHI RIE12013
HAYASHI TELEMPU KK12007
Locations
LocationPatentsSpan
Tokyo, JP32010–2013
Wako, JP22000–2014
Saitama, JP21993–2013
Dublin, OH, US22004–2007
Nagaokakyo, JP12016