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Inventor

Jacob Jeng

Inventor
Hsinchu, TW

Overview

2→
Patents
2000–2001
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10100%
PatentTitleYear
6,200,828'Integrated circuit package architecture with a variable dispensed compound and method of manufacturing the same'20016,133,067'Architecture for dual-chip integrated circuit package and method of manufacturing the same'2000

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2000–2001Patents assigned to AMIC TECHNOLOGY INC (2)· patent assignee history
2000–2001Based in Hsinchu, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
AMIC TECHNOLOGY INC22000–2001
Locations
LocationPatentsSpan
Hsinchu, TW22000–2001