Inventor
MARY CLAIRE SILVESTRE
Inventor
US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
G01BMeasuring length, thickness or similar linear dimensions6%
G01NInvestigating or analysing materials by determining their chemical or physical properties6%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices6%
G11CStatic stores6%
H03KPulse technique6%
H10DInorganic electric semiconductor devices6%
H10NElectric solid-state devices not otherwise provided for6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
PatentTitleYear
12,438,084Dual-metal ultra thick metal (UTM) structure202512,142,556X-ray shielding structure for a chip202412,113,013Dual color via patterning202412,010,930Wrap-around projection liner for AI device202411,670,580Subtractive via etch for MIMCAP202311,600,325Non volatile resistive memory logic device202311,569,134Wafer backside engineering for wafer stress control2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2025Patents assigned to IBM (7)· patent assignee history
2023–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 7 | 2023–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 7 | 2023–2025 |