Inventor

Reikou Fukazaki

Inventor
Tokyo, JP

Overview

4→
Patents
2001–2004
Patent span
Performing operations
Primary field (CPC B)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C03Bprimary
C03BManufacture, shaping, or supplementary processes30%
G02BOptical elements, systems or apparatus30%
B29CShaping or joining of plastics10%
B29DProducing particular articles from plastics or from substances in a plastic state10%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts10%
B29LIndexing scheme associated with subclass b29c, relating to particular articles10%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2004Patents assigned to HOYA CORP (4)· patent assignee history
2001–2004Based in Tokyo, JP· patent location history
2002Based in Kodaira, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HOYA CORP42001–2004
Locations
LocationPatentsSpan
Tokyo, JP32001–2004
Kodaira, JP12002