LexDanaLexDanabeta
Inventor

Ming-Liang Huang

Inventor
Tainan, TW

Overview

5→
Patents
1994–2021
Patent span
Physics
Primary field (CPC G)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
G06VImage or video recognition or understanding25%
A61BDiagnosis13%
A61CDentistry13%
G01SRadio direction-finding13%
PatentTitleYear
11,092,680Ultrasound system for high-speed and high resolution imaging applications20217,936,032'Film type package for fingerprint sensor'20117,812,422'Film type package for fingerprint sensor'20106,960,491'Integrated circuit packaging for improving effective chip-bonding area'20055,279,315'Dental floss assembly'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994Patents assigned to HUANG MING LIANG (1)· patent assignee history
1994–2011Based in Tainan, TW· patent location history
2005–2011Patents assigned to CHIPMOS TECHNOLOGIES INC (3)· patent assignee history
2005Based in Kaohsiung, TW· patent location history
2011Patents assigned to CHIPMOS TECHNOLOGIES BERMUDA (1)· patent assignee history
2021Patents assigned to UNIV ROCHESTER (1)· patent assignee history
2021Based in Rochester, NY, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHIPMOS TECHNOLOGIES INC32005–2011
CHIPMOS TECHNOLOGIES BERMUDA12011
HUANG MING LIANGself11994
UNIV ROCHESTER12021
Locations
LocationPatentsSpan
Tainan, TW31994–2011
Rochester, New York, US12021
Kaohsiung, TW12005