Inventor
Dingying Xu
Inventor
Chandler, AZ, US
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
H01LSemiconductor devices9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
Y10TTechnical subjects covered by former us classification8%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds6%
C08LCompositions of macromolecular compounds6%
C09DCoating compositions, e.g. paints, varnishes or lacquers6%
G01RMeasuring electric variables6%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients5%
C07FAcyclic, carbocyclic or heterocyclic compounds containing elements other than carbon, hydrogen, halogen, oxygen, nitrogen, sulfur, selenium or tellurium3%
PatentTitleYear
10,598,696Probe pins with etched tips for electrical die test202010,499,461Thermal head with a thermal barrier for integrated circuit die processing201910,168,357Coated probe tips for plunger pins of an integrated circuit package test system20199,941,652Space transformer with perforated metallic plate for electrical die test20189,793,151'Stiffener tape for electronic assembly'20179,659,889'Solder-on-die using water-soluble resist system and method'20179,543,197'Package with dielectric or anisotropic conductive (ACF) buildup layer'20179,472,517'Dry-removable protective coatings'20169,458,283'Flexible underfill compositions for enhanced reliability'20169,068,067'Flexible underfill compositions for enhanced reliability'20158,569,108'Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die'20138,466,559'Forming die backside coating structures with coreless packages'20138,304,065'Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same'20128,287,996'Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die'20127,851,342'In-situ formation of conductive filling material in through-silicon via'20107,638,867'Microelectronic package having solder-filled through-vias'20097,557,036'Method, system, and apparatus for filling vias'20096,492,308'Post chemical-mechanical planarization (CMP) cleaning composition'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002Based in Bethlehem, PA, US· patent location history
2009–2020Patents assigned to INTEL CORP (16)· patent assignee history
2009–2020Based in Chandler, AZ, US· patent location history
2009–2017Based in Maricopa, AZ, US· patent location history
2012–2016Patents assigned to XU DINGYING (6)· patent assignee history
2012–2013Patents assigned to MAMODIA MOHIT (4)· patent assignee history
2012–2013Patents assigned to ARANA LEONEL R (2)· patent assignee history
2012–2013Patents assigned to MANEPALLI RAHUL (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 16 | 2009–2020 |
| XU DINGYINGself | 6 | 2012–2016 |
| MAMODIA MOHIT | 4 | 2012–2013 |
| ARANA LEONEL R | 2 | 2012–2013 |
| MANEPALLI RAHUL | 2 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chandler, AZ, US | 9 | 2009–2020 |
| Maricopa, AZ, US | 8 | 2009–2017 |
| Bethlehem, Pennsylvania, US | 1 | 2002 |