Inventor
Kazuhiro Atsumi
Inventor
Hamamatsu, JP
Overview
Patents· 25 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
B28DWorking stone or stone-like materials15%
C03BManufacture, shaping, or supplementary processes8%
Y02PClimate change mitigation technologies in the production or processing of goods6%
Y10TTechnical subjects covered by former us classification6%
B65GTransport or storage devices, e.g. conveyors for loading or tipping, shop conveyor systems or pneumatic tube conveyors5%
C03CChemical composition of glasses, glazes or vitreous enamels5%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein5%
G01NInvestigating or analysing materials by determining their chemical or physical properties4%
PatentTitleYear
10,293,433Laser processing method and device20199,511,449'Laser processing method and device'20169,352,414'Laser processing method and device'20169,012,805'Laser working method'20158,993,922'Laser processing method and device'20158,950,217'Method of cutting object to be processed, method of cutting strengthened glass sheet and method of manufacturing strengthened glass member'20158,933,368'Laser processing method for cutting planar object'20158,890,027'Laser processing method and laser processing system'20148,816,245'Method of cutting object to be processed'20148,735,770'Laser processing method for forming a modified region in an object'20148,685,838'Laser beam machining method'20148,624,153'Laser processing method and device'20148,563,893'Laser material processing system'20138,551,817'Semiconductor substrate cutting method'20138,513,567'Laser processing method for forming a modified region for cutting in an object'20138,247,734'Laser beam machining method'20128,058,103'Semiconductor substrate cutting method'20117,626,137'Laser cutting by forming a modified region within an object and generating fractures'20097,615,721'Laser processing method and laser processing apparatus'20097,592,238'Laser processing method and laser processing apparatus'20097,547,613'Laser processing method and laser processing apparatus'20096,161,878'External cover pipe for fluid transport pipe'20005,637,874'Apparatus and method for measuring chemiluminescence'19975,576,212'Oxidizing composition in powder form'19965,523,845'A fiber optic device for measuring liquids which are drawn into an end of the device to a predetermined distance from the end of the optical fibers'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996–2019Based in Hamamatsu, JP· patent location history
2000Based in Toyonaka, JP· patent location history
2009–2019Patents assigned to HAMAMATSU PHOTONICS KK (21)· patent assignee history
2011–2016Patents assigned to ATSUMI KAZUHIRO (15)· patent assignee history
2011–2014Patents assigned to FUKUMITSU KENSHI (6)· patent assignee history
2011–2014Patents assigned to FUKUYO FUMITSUGU (6)· patent assignee history
2013–2016Patents assigned to KUNO KOJI (7)· patent assignee history
2013Based in Shizuoka, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HAMAMATSU PHOTONICS KK | 21 | 2009–2019 |
| ATSUMI KAZUHIROself | 15 | 2011–2016 |
| KUNO KOJI | 7 | 2013–2016 |
| FUKUMITSU KENSHI | 6 | 2011–2014 |
| FUKUYO FUMITSUGU | 6 | 2011–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hamamatsu, JP | 23 | 1996–2019 |
| Shizuoka, JP | 1 | 2013 |
| Toyonaka, JP | 1 | 2000 |