Inventor
Layal Rouhana
Inventor
San Diego, CA, US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
B23KSoldering or unsoldering8%
H01FMagnets8%
H10DInorganic electric semiconductor devices8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
PatentTitleYear
10,651,160Low profile integrated package202010,157,824Integrated circuit (IC) package and package substrate comprising stacked vias20189,496,213'Integrated device package comprising a magnetic core inductor with protective ring embedded in a package substrate'20169,355,898'Package on package (PoP) integrated device comprising a plurality of solder resist layers'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2020Patents assigned to QUALCOMM INC (4)· patent assignee history
2016–2020Based in San Diego, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| QUALCOMM INC | 4 | 2016–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Diego, California, US | 4 | 2016–2020 |