Inventor
Michael F. McAllister
Inventor
Clintondale, NY, US
Overview
Patents· 32 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
H05KPrinted circuits24%
G01RMeasuring electric variables20%
Y10TTechnical subjects covered by former us classification13%
H01LSemiconductor devices5%
G06FElectric digital data processing4%
H01RElectrically-conductive connections4%
H10DInorganic electric semiconductor devices4%
PatentTitleYear
8,929,086'Gel package structural enhancement of compression system board connections'20158,796,140'Hybrid conductor through-silicon-via for power distribution and signal transmission'20148,791,550'Hybrid conductor through-silicon-via for power distribution and signal transmission'20148,785,289'Integrated decoupling capacitor employing conductive through-substrate vias'20148,558,345'Integrated decoupling capacitor employing conductive through-substrate vias'20137,987,587'Method of forming solid vias in a printed circuit board'20117,930,820'Method for structural enhancement of compression system board connections'20117,543,373'Gel package structural enhancement of compression system board connections'20097,363,688'Land grid array structures and methods for engineering change'20087,344,919'Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffener'20087,284,992'Electronic package structures using land grid array interposers for module-to-board interconnection'20077,077,660'Land grid array structures and methods for engineering change'20066,954,984'Land grid array structure'20056,605,953'Method and apparatus of interconnecting with a system board'20036,549,024'Method of interconnecting with a system board'20036,538,460'Method and apparatus for enhancing a system board'20036,529,023'Application and test methodology for use with compression land grid array connectors'20036,462,573'System interface assembly and method'20026,444,919'Thin film wiring scheme utilizing inter-chip site surface wiring'20026,433,562'Method and apparatus of interconnecting with a system board'20026,429,644'Method and apparatus of interconnecting with a system board'20026,342,788'Probing systems for chilled environment'20026,252,391'High frequency probe'20015,817,543'Method of constructing an integrated circuit memory'19985,757,079'Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structure'19985,747,095'Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages'19985,523,619'High density memory structure'19965,378,927'Thin-film wiring layout for a non-planar thin-film structure'19955,354,955'Direct jump engineering change system'19945,264,664'Programmable chip to circuit board connection'19934,734,046'Coaxial converter with resilient terminal'19884,603,023'Method of making a hybrid dielectric probe interposer'1986Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1986–2015Patents assigned to IBM (32)· patent assignee history
1986–2008Based in Clintondale, NY, US· patent location history
2007–2015Based in New Milford, CT, US· patent location history
2013–2015Patents assigned to MCALLISTER MICHAEL F (2)· patent assignee history
2013Patents assigned to KIM TAE HONG (1)· patent assignee history
2013Based in Hopewell Junction, NY, US· patent location history
2015Patents assigned to PROSS HARALD (1)· patent assignee history
2015Patents assigned to RUEHLE GERHARD H (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 32 | 1986–2015 |
| MCALLISTER MICHAEL Fself | 2 | 2013–2015 |
| KIM TAE HONG | 1 | 2013 |
| PROSS HARALD | 1 | 2015 |
| RUEHLE GERHARD H | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Clintondale, New York, US | 22 | 1986–2008 |
| New Milford, CT, US | 9 | 2007–2015 |
| Hopewell Junction, New York, US | 1 | 2013 |