Inventor
Hideo Kudo
Inventor
Fukushima, JP
Overview
Patents· 47 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests16%
B24BMachines, devices, or processes for grinding or polishing13%
Y10TTechnical subjects covered by former us classification11%
G11BInformation storage based on relative movement between record carrier and transducer10%
C30BSingle-crystal growth3%
B29CShaping or joining of plastics2%
B65DContainers for storage or transport of articles or materials, e.g. bags, barrels, bottles, boxes, cans, cartons, crates, drums, jars, tanks, hoppers, forwarding containers2%
B08BCleaning in general1%
B28DWorking stone or stone-like materials1%
PatentTitleYear
8,567,384'Slicing method and wire saw apparatus'20138,492,879'Semiconductor substrate and semiconductor device'20138,454,410'Polishing apparatus'20138,318,275'Multi-color molding article, multicolor molding method and substrate storage container'20128,118,646'Carrier for double-side polishing apparatus, double-side polishing apparatus using the same, and double-side polishing method'20127,017,749'Precision substrate storage container and retaining member therefor'20066,951,340'Gaskets for substrate containers'20056,841,218'Write once optical recording medium'20056,828,000'Optical recording medium'20046,432,837'Semiconductor wafer processing method and semiconductor wafers produced by the same'20026,402,594'Polishing method for wafer and holding plate'20026,346,485'Semiconductor wafer processing method and semiconductor wafers produced by the same'20026,239,039'Semiconductor wafers processing method and semiconductor wafers produced by the same'20016,110,839'Method of purifying alkaline solution and method of etching semiconductor wafers'20006,077,149'Method and apparatus for surface-grinding of workpiece'20006,050,880'Surface grinding device and method of surface grinding a thin-plate workpiece'20005,951,374'Method of polishing semiconductor wafers'19995,942,445'Method of manufacturing semiconductor wafers'19995,914,053'Apparatus and method for double-sided polishing semiconductor wafers'19995,891,353'Polishing agent used for polishing semiconductor wafers and polishing method using the same'19995,866,226'Polishing agent used for polishing semiconductor wafers and polishing method using the same'19995,827,779'Method of manufacturing semiconductor mirror wafers'19985,827,395'Polishing pad used for polishing silicon wafers and polishing method using the same'19985,821,167'Method of manufacturing semiconductor mirror wafers'19985,800,725'Method of manufacturing semiconductor wafers'19985,790,252'Method of and apparatus for determining residual damage to wafer edges'19985,768,243'Optical recording medium and its recording apparatus and reproducing apparatus'19985,759,087'Method for inducing damage for gettering to single crystal silicon wafer'19985,705,423'Epitaxial wafer'19985,679,212'Method for production of silicon wafer and apparatus therefor'19975,656,348'Optical recording medium and its recording apparatus and reproducing apparatus'19975,595,412'Device for handling wafers'19975,555,634'Wafer holder'19965,547,515'Method for handling or processing semiconductor wafers'19965,503,173'Wafer cleaning tank'19965,474,644'Method and apparatus for high-flatness etching of wafer'19955,447,890'Method for production of wafer'19955,317,778'Automatic cleaning apparatus for wafers'19945,282,289'Scrubber apparatus for cleaning a thin disk work'19945,185,730'Method for reading data from optical disk'19935,179,547'Phase change optical information recording medium including means for preventing movement of the recorded portion'19935,126,027'Thin film forming method and system'19925,117,590'Method of automatically chamfering a wafer and apparatus therefor'19925,081,733'Automatic cleaning apparatus for disks'19925,039,558'Optical recording medium and method of manufacturing thereof'19915,025,439'Method for recording and reproducing of information on an optical disk of a phase-change type'19914,950,520'Optical recording medium and method manufacturing thereof'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990–1998Patents assigned to PIONEER ELECTRONIC CORP (7)· patent assignee history
1990–1993Based in Saitama, JP· patent location history
1992–2013Patents assigned to SHINETSU HANDOTAI KK (35)· patent assignee history
1992–2013Patents assigned to KUDO HIDEO (6)· patent assignee history
1992–2012Based in Fukushima, JP· patent location history
1997–2005Based in Tsurugashima, JP· patent location history
1998–2013Based in Nishishirakawa, JP· patent location history
2001–2013Based in Tokyo, JP· patent location history
2005–2012Patents assigned to SHINETSU POLYMER CO (3)· patent assignee history
2013Patents assigned to KITAGAWA KOJI (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHINETSU HANDOTAI KK | 35 | 1992–2013 |
| PIONEER ELECTRONIC CORP | 7 | 1990–1998 |
| KUDO HIDEOself | 6 | 1992–2013 |
| SHINETSU POLYMER CO | 3 | 2005–2012 |
| KITAGAWA KOJI | 2 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Fukushima, JP | 26 | 1992–2012 |
| Nishishirakawa, JP | 5 | 1998–2013 |
| Tokyo, JP | 4 | 2001–2013 |
| Tsurugashima, JP | 4 | 1997–2005 |
| Saitama, JP | 4 | 1990–1993 |