Inventor
TSUNG-SHU LIN
Inventor
TW
Overview
Patents· 43 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution2%
G06FElectric digital data processing1%
PatentTitleYear
12,550,783Device and method for UBM/RDL routing202612,550,729Heat spreading device and method202612,538,816Package structure having line connected via portions202612,506,087Semiconductor package with redistribution structure and manufacturing method thereof202512,476,140Semiconductor package including step seal ring and methods forming same202512,412,805Semiconductor package202512,394,754Device and method for UBM/RDL routing202512,387,988Method of manufacturing semiconductor package having lid structure202512,327,819Devices employing thermal and mechanical enhanced layers and methods of forming same202512,322,727Device and method for UBM/RDL routing202512,191,239Stacked via structure disposed on a conductive pillar of a semiconductor die202512,191,224Semiconductor package and manufacturing method thereof202512,170,237Semiconductor structure and manufacturing method thereof202412,094,836Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereof202412,080,623Integrated circuit packages having mechanical brace standoffs202412,074,154Package structure202412,021,006Package structure and method and equipment for forming the same202411,996,342Semiconductor package comprising heat dissipation plates202411,955,401Package structure202411,955,439Semiconductor package with redistribution structure and manufacturing method thereof202411,929,293Semiconductor package with lid structure202411,923,310Package structure including through via structures202411,901,320Contact pad for semiconductor device202411,855,030Package structure and method of manufacturing the same202311,855,018Semiconductor device and method of manufacture202311,855,025Semiconductor device and package assembly including the same202311,810,833Package structure and method and equipment for forming the same202311,756,870Stacked via structure disposed on a conductive pillar of a semiconductor die202311,715,675Semiconductor device and manufacturing method thereof202311,676,943Semiconductor structure and manufacturing method thereof202311,652,063Semiconductor package and method of forming the same202311,626,341Package structure202311,594,469Semiconductor device and method of manufacture202311,587,845Semiconductor structure202311,581,268Semiconductor package with redistribution structure and manufacturing method thereof202311,527,502Contact pad for semiconductor device202211,515,229Semiconductor package and manufacturing method thereof202211,469,218Devices employing thermal and mechanical enhanced layers and methods of forming same202211,302,600Semiconductor device and manufacturing method thereof202211,289,398Package structure and manufacturing method thereof202211,282,825Package structure202211,276,656Integrated fan-out structure and method of forming202211,195,802Semiconductor package including shielding plate in redistribution structure, semiconductor package including conductive via in redistribution structure, and manufacturing method thereof2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (43)· patent assignee history
2021–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 43 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 43 | 2021–2026 |