Inventor
Jia-Wei Fang
Inventor
Hsinchu, TW
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H01LSemiconductor devices28%
G06FElectric digital data processing24%
H03KPulse technique8%
G01KMeasuring temperature4%
H10DInorganic electric semiconductor devices4%
PatentTitleYear
10,109,566Semiconductor package201810,067,000Inverter and ring oscillator with high temperature sensitivity20189,904,751'Computer-implemented method of designing a modularized stacked integrated circuit'20189,904,752'Methods for distributing power in layout of IC'20189,679,830'Semiconductor package'20179,660,017'Microelectronic package with surface mounted passive element'20179,589,092'Method for co-designing flip-chip and interposer'20179,552,452'Method and apparatus for flip chip packaging co-design and co-designed flip chip package'20179,490,808'Sensing circuit'20169,379,079'Flip chip scheme and method of forming flip chip scheme'20169,305,131'Method for flip chip packaging co-design'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2018Patents assigned to MEDIATEK INC (11)· patent assignee history
2016–2018Based in Hsinchu, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MEDIATEK INC | 11 | 2016–2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 11 | 2016–2018 |