Inventor
Hiroshi Honmou
Inventor
Tokyo, JP
Overview
Patents· 12 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G02Bprimary
G02BOptical elements, systems or apparatus38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
B23KSoldering or unsoldering5%
B26DCutting5%
G01BMeasuring length, thickness or similar linear dimensions5%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light5%
H05KPrinted circuits5%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
Y10TTechnical subjects covered by former us classification5%
PatentTitleYear
6,212,212'Optical module'20016,161,965'Optical coupling circuit'20006,019,523'Optical semiconductor module and method for manufacturing same'20005,929,500'Light receiving device for use in optical fiber communications and the like'19995,877,853'Method of evaluating an optical transmission path'19995,717,803'Coupling structure of optical fiber and optical semiconductor element'19985,662,817'Method for forming tip of array optical fiber using etching process'19975,661,831'Optical module having self-aligned optical element and optical wave-guide by means of bumps on rectangular pads and method of assembling thereof'19975,573,170'Bump forming apparatus'19965,563,969'Apparatus and method for forming a hemispherical microlens at the end of optical fiber'19965,392,372'Optical coupling equipment for an optical semiconductor and an optical fiber'19955,275,970'Method of forming bonding bumps by punching a metal ribbon'1994Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994–2001Patents assigned to NEC CORP (12)· patent assignee history
1994–2001Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NEC CORP | 12 | 1994–2001 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 12 | 1994–2001 |