Inventor
George J. Saxenmeyer, Jr.
Inventor
Apalachin, NY, US
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Rprimary
H01RElectrically-conductive connections23%
H05KPrinted circuits19%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
Y10TTechnical subjects covered by former us classification15%
H01GCapacitors8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
G01RMeasuring electric variables4%
G06FElectric digital data processing4%
PatentTitleYear
6,414,509'Method and apparatus for in-situ testing of integrated circuit chips'20025,813,870'Selectively filled adhesives for semiconductor chip interconnection and encapsulation'19985,799,379'Method of manufacturing a decoupling capacitor structure'19985,517,385'Decoupling capacitor structure'19965,506,992'Distributed processing system with asynchronous communication between processing modules'19965,248,262'High density connector'19935,237,743'Method of forming a conductive end portion on a flexible circuit member'19935,199,879'Electrical assembly with flexible circuit'19935,185,073'Method of fabricating nendritic materials'19935,137,461'Separable electrical connection technology'19924,254,431'Restorable backbond for LSI chips using liquid metal coated dendrites'1981Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1981–2002Patents assigned to IBM (10)· patent assignee history
1981–2002Based in Apalachin, NY, US· patent location history
1996Based in Owego, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 10 | 1981–2002 |
Locations
| Location | Patents | Span |
|---|---|---|
| Apalachin, New York, US | 10 | 1981–2002 |
| Owego, New York, US | 1 | 1996 |