Inventor
Tsung Wen Chang
Inventor
Tainan, TW
Overview
Patents· 2 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B29Cprimary
B29CShaping or joining of plastics20%
G06FElectric digital data processing20%
H01LSemiconductor devices20%
H05KPrinted circuits20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
PatentTitleYear
9,778,712'Method of integrating a server using alternating current power into a server system using direct current power and alternative junction device therefor'20178,956,920'Leadframe for integrated circuit die packaging in a molded package and a method for preparing such a leadframe'2015Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2015Patents assigned to CHANG TSUNG WEN (1)· patent assignee history
2015Patents assigned to CHERN CHYI KEH (1)· patent assignee history
2015Patents assigned to NXP BV (1)· patent assignee history
2015Based in Kaohsiung, TW· patent location history
2017Patents assigned to LITE ON TECHNOLOGY CORP (1)· patent assignee history
2017Patents assigned to LITE-ON ELECTRONICS (GUANGZHOU) CO LTD (1)· patent assignee history
2017Based in Tainan, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| CHANG TSUNG WENself | 1 | 2015 |
| CHERN CHYI KEH | 1 | 2015 |
| LITE ON TECHNOLOGY CORP | 1 | 2017 |
| LITE-ON ELECTRONICS (GUANGZHOU) CO LTD | 1 | 2017 |
| NXP BV | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tainan, TW | 1 | 2017 |
| Kaohsiung, TW | 1 | 2015 |