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Inventor

Chi-Jen Hsieh

Inventor
Taipei, TW

Overview

3→
Patents
2017–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
B05DProcesses for applying fluent materials to surfaces, in general11%
B08BCleaning in general11%
G01RMeasuring electric variables11%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
PatentTitleYear
11,041,883Probe card device and rectangular probe thereof202110,115,581Removal of particles on back side of wafer20189,720,325'Photoresist coating scheme'2017

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2017–2018Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (2)· patent assignee history
2017Based in Toufen Township, TW· patent location history
2018Based in Miao-Li County, TW· patent location history
2021Patents assigned to CHUNGHWA PREC TEST TECH CO LTD (1)· patent assignee history
2021Based in Taipei, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD22017–2018
CHUNGHWA PREC TEST TECH CO LTD12021
Locations
LocationPatentsSpan
Taipei, TW12021
Miao-Li County, TW12018
Toufen Township, TW12017