Inventor
Gregory J. Dunn
Inventor
Arlington Heights, IL, US
Overview
Patents· 55 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits33%
Y10TTechnical subjects covered by former us classification16%
H01GCapacitors11%
H01CResistors7%
H01QAntennas, i.e. radio aerials4%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices2%
G06TImage data processing or generation, in general2%
H04NPictorial communication, e.g. television2%
H04MTelephonic communication2%
PatentTitleYear
9,253,416'Modulation of background substitution based on camera attitude and motion'20168,947,534'System and method for providing depth imaging'20158,652,920'Substrate with embedded patterned capacitance'20148,504,640'Device recruitment for stereoscopic imaging applications'20138,470,680'Substrate with embedded patterned capacitance'20138,410,536'Substrate with embedded patterned capacitance'20138,111,913'Countermeasures against original background retrieval'20128,036,716'Temporary storage or specialized transmission of multi-microphone signals'20118,007,110'Projector system employing depth perception to detect speaker position and gestures'20117,833,292'Channel method for forming a capacitor'20107,745,281'Thin solid electrolytic capacitor embeddable in a substrate'20107,605,048'Method for forming a capacitor having a copper electrode and a high surface area aluminum inner layer'20097,557,304'Printed circuit board having closed vias'20097,528,788'High impedance electromagnetic surface and method'20097,518,465'Tunable high impedance surface device'20097,459,202'Printed circuit board'20087,451,540'Method for fabricating a printed circuit board'20087,444,727'Method for forming multi-layer embedded capacitors on a printed circuit board'20087,427,562'Method for fabricating closed vias in a printed circuit board'20087,423,608'High impedance electromagnetic surface and method'20087,361,568'Embedded capacitors and methods for their fabrication and connection'20087,361,847'Capacitance laminate and printed circuit board apparatus and method'20087,337,528'Textured dielectric patch antenna fabrication method'20087,241,510'Peelable circuit board foil'20077,193,838'Printed circuit dielectric foil and embedded capacitors'20077,138,068'Printed circuit patterned embedded capacitance layer'20067,105,913'Two-layer patterned resistor'20067,078,796'Corrosion-resistant copper bond pad and integrated device'20067,079,373'Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuit'20067,056,800'Printed circuit embedded capacitors'20067,038,571'Polymer thick film resistor, layout cell, and method'20067,030,815'Integrated patch antenna and electronics assembly and method for fabricating'20066,872,468'Peelable circuit board foil'20056,841,080'Multi-layer conductor-dielectric oxide structure'20056,777,727'Flexural plate wave systems'20046,638,872'Integration of monocrystalline oxide devices with fully depleted CMOS on non-silicon substrates'20036,606,793'Printed circuit board comprising embedded capacitor and method of same'20036,541,137'Multi-layer conductor-dielectric oxide structure'20036,507,993'Polymer thick-film resistor printed on planar circuit board surface'20036,440,318'Printed circuit board with a multilayer integral thin-film metal resistor and method therefor'20026,349,456'Method of manufacturing photodefined integral capacitor with self-aligned dielectric and electrodes'20026,342,164'Pinhole-free dielectric films'20026,256,866'Polymer thick-film resistor printed on planar circuit board surface'20016,232,042'Method for manufacturing an integral thin-film metal resistor'20016,229,098'Method for forming a thick-film resistor and thick-film resistor formed thereby'20016,194,990'Printed circuit board with a multilayer integral thin-film metal resistor and method therefor'20016,171,921'Method for forming a thick-film resistor and thick-film resistor formed thereby'20016,130,601'Thick-film resistor having concentric terminals and method therefor'20006,108,212'Surface-mount device package having an integral passive component'20006,103,134'Circuit board features with reduced parasitic capacitance and method therefor'20005,994,997'Thick-film resistor having concentric terminals and method therefor'19995,912,507'Solderable pad with integral series termination resistor'19995,219,773'Method of making reoxidized nitrided oxide MOSFETs'19934,698,236'Augmented carbonaceous substrate alteration'19874,365,134'Method of resistance welding'1982Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1982Based in Cambridge, MA, US· patent location history
1987Based in Gloucester, MA, US· patent location history
1993Based in Tewksbury, MA, US· patent location history
1999–2013Patents assigned to MOTOROLA INC (43)· patent assignee history
1999–2016Based in Arlington Heights, IL, US· patent location history
2008–2014Patents assigned to KEMET ELECTRONICS CORP (7)· patent assignee history
2011–2016Patents assigned to MOTOROLA SOLUTIONS INC (4)· patent assignee history
2012–2016Patents assigned to DUNN GREGORY J (7)· patent assignee history
2013–2014Patents assigned to CHACKO ANTONY P (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MOTOROLA INC | 43 | 1999–2013 |
| DUNN GREGORY Jself | 7 | 2012–2016 |
| KEMET ELECTRONICS CORP | 7 | 2008–2014 |
| MOTOROLA SOLUTIONS INC | 4 | 2011–2016 |
| CHACKO ANTONY P | 3 | 2013–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Arlington Heights, Illinois, US | 52 | 1999–2016 |
| Tewksbury, Massachusetts, US | 1 | 1993 |
| Gloucester, Massachusetts, US | 1 | 1987 |
| Cambridge, Massachusetts, US | 1 | 1982 |